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Non-Destructive Dislocation Characterization in SiC Substrates Using XRTmicron Technology

Join this webinar to discover the X-ray Topography methodology, the scientific principles of measurements and the possibilities of the instrumentation. The webinar will focus on applications on different materials and the results, demonstrating how the XRTmicron system is used to get highest quality 2D and 3D topograms of semiconductor material.

Additive Manufacturing in Computed Tomography

In this episode, we will discuss how X-ray computed tomography (CT) can non-destructively access these internal structures, voids, cracks, as well as the external shape. Dimensional inspection including actual to nominal comparison, section thickness,  mechanical load distribution of final product, as well as metal powder morphology are characterized for both qualitative visual inspection and quantitative analysis. Analysis examples from various AM feedstock, such as polymer, metal, and ceramic will be discussed. 

Functional Failure Analysis

In this episode, we will define what a functional failure is and review how you can use X-ray CT to characterize various defects that can cause diminished or loss of function.